STR is a worldwide manufacturer of Photocap® encapsulant, having been the first one to develop in 1975 an encapsulation product specifically devoted for PV applications. Currently we count with presence in different continents: USA, Europe and Asia, where in all of them we manufacture the same type of products that are globally distributed. We have In-house R&D Department and provide our customers technical service and support. Photocap® encapsulants are base on ethylene vinyl acetate (EVA) copolymer that is specifically formulated to provide structural support, electrical isolation, physical isolation/protection, and thermal conduction for solar circuits, as well as to maximize the life of solar cells. Photocap® has been developed to provide:
Fast processing using lamination conditions compatible with other module components
Bubble and void-free lamination
Ease of handling
Automation potential
High light transmission
Adhesion to module components
Protection of the PV module against damage caused by environmental factors
Cost-effective performance (greater than 20 years service life under proper PV conditions)
Self-priming encapsulants are available for each formulation. In the self-priming grades, the active primer ingredient is blended into the EVA resin resulting in an encapsulant that can bond directly to module surfaces during lamination without a separate priming step. These self-priming grades are designated by a "P" suffix. All encapsulant formulations can be manufactured via STR's proprietary, "User-Friendly" (UF) process. The UF process is a method of manufacturing non-shrink encapsulant sheet. UF encapsulants do not shrink during the lamination process; eliminating shrinkage-induced void formation. UF products therefore tolerate aggressive temperature ramping during lamination, and permit higher throughput.
Parque Tecnologico de Asturias Parcela 36
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